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备有3 个插槽的H61 I系列四核无风扇嵌入式系统,2个PCI,1个PCIE*16.
特点：
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第 2 代 Intel® Core™ 低功耗台式处理器
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·板载 2GB DDR3 内存和1个 DDR3 SO-DIMM 插槽(系统最大支持 10GB)
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·冗余宽范围双直流电源输入支持 (9 ~ 24 VDC)
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·灵活的 PCI/PCIe 扩展槽满足客制化需求
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·丰富的 I/O 接口满足多种应用
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·双 PCIe GbE LAN 支持高速网络应用程序
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·1个 CompactFlash® socket
规格：
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外观颜色 |
黑色 C + 银色 |
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尺寸(D×W×H)(mm) |
133 x 269 x 208 mm |
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系统风扇 |
无风扇 |
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机箱材质 |
挤压铝合金 |
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芯片组 |
Intel® H61 |
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内存 |
板载 DDR3 2GB 内存
1 x 204-pin DDR3 SDRAM SO-DIMM (系统最大支持: 10GB) |
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硬盘 |
1 x 2.5'' SATA HDD Bay |
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以太网 |
2 x RJ-45 Realtek 8111E GbE LAN 支持 ASF 2.0 |
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显示接口 |
1 x VGA, 1 x DVI-I |
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Resolution |
VGA : 2048 x 1536 @ 75Hz
DVI-I : 1920 x 1080 @ 60Hz |
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音频 |
1 x 音频输出, 1 x 麦克风输入 |
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扩展槽 |
PCI:
2P1E : 2 x PCI, 1P2E : 1 x PCI
PCIe:
2P1E : One PCIe x 8 (physical PCIe x 16 slot)
1P2E : One PCIe x 1 (physical x 4 slot), One PCIe x 8 (physical x 16 slot) |
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电源输入 |
冗余双直流电源输入
接线端子 : 9~24V
电源插孔 : 9~24V |
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功耗 |
19V@3.5A (Intel® Core i3-2100 支持 6GB DDR3 内存) 不包含附加卡 |
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安装方式 |
Wall mount |
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工作温度 |
-20°C ~ 70°C 有风流 (SSD), 5% ~ 95%, 无冷凝 |
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抗震动 |
MIL-STD-810F 514.5C-2 (with SSD) |
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抗冲击 |
Half-sine wave shock 5G, 11ms, 3 shocks per axis |
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重量(NW/GW) |
4.2 Kg / 6.3 Kg |
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电磁兼容性/安规认证 |
CE / FCC |
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Supported OS |
Microsoft® WES7E, Microsoft® Windows® XP Embedded |
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Storage |
CompactFlash®: 1 x CF Type II |
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处理器 |
2nd Generation Intel®
-Core i5 Dual Core 2xxT (Above 2.7GHz), 35W
-Core i3 Dual Core 2xxT (Above 2.5GHz), 35W
-Pentium Dual Core G6xxT (Above 2.2GHz), 35W |
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I/O |
2 x USB 3.0
4 x USB 2.0
RS-232: 4 x DB-9, 2 x DB-9 带隔离保护
8 bit 数字 I/O, 4 bit 输入 / 4 bit 输出 |
订购信息：
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TANK-820-H61-P/2G/2P1E-R21 |
Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C,R21 |
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TANK-820-H61-P/2G/1P2E-R21 |
Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R21 |
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TANK-820-H61-i3/2G/2P1E-R21 |
Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C,R21 |
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TANK-820-H61-i3/2G/1P2E-R21 |
Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R21 |
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TANK-820-H61-i5/2G/2P1E-R21 |
Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C,R21 |
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TANK-820-H61-i5/2G/1P2E-R21 |
Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board,-20°C~60°C, R21 |
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